AstraControl

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ESP32-based control PCB uses WiFi with an external antenna and 5Mbps RS-485 for communication, supporting various sensors and HMI devices for high-power LED fixtures or strips. Device can be configured to be a master or slave. The board connects to AstraDriver a high power LED driver board that uses 4x LED2001 drivers. Direct copper heat-sink PCB for LED diode AstraBeamLED. Power Distribution board AstraControlPower.

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GitHub last commit

Table of contents

Render Top Angled

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Render Top

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Render Bottom

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Schematic

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Monochromatic

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Assembly

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Gerber viewer on tracespace.io

https://tracespace.io/view/?boardUrl=https://liveleds.github.io/AstraControl/export/AstraControl-JLCPCB.zip?v=1736537456

Interactive BOM

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BOM

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JLCPCB

Eurocircuits

3D Step

Report

ERC

ERC Report

DRC

DRC Report

PCB

Board size: 102.0x96.0 mm (4.02x3.78 inches)

Solder mask: TOP / BOTTOM

Silk screen: TOP / BOTTOM

Stackup:

Impedance controlled: YES

Name Type Color Thickness [µm] Material Er Loss tan
F.SilkS Top Silk Screen White        
F.Paste Top Solder Paste          
F.Mask Top Solder Mask   10      
F.Cu copper   35      
dielectric 1 prepreg FR4 natural 210 FR4 4.4 0.020
In1.Cu copper   15      
dielectric 2 core FR4 natural 1065 FR4 4.6 0.020
In2.Cu copper   15      
dielectric 3 prepreg FR4 natural 210 FR4 4.4 0.020
B.Cu copper   35      
B.Mask Bottom Solder Mask   10      
B.Paste Bottom Solder Paste          
B.SilkS Bottom Silk Screen White        

Important sizes

Clearance: 0.2 mm (8 mils)

Track width: 0.19 mm (8 mils)

Drill: 0.4 mm (16 mils)

Via: 0.8/0.4 mm (31/16 mils)

Outer Annular Ring: 0.05 mm (2 mils)

Eurocircuits class: 10C

General stats

Components count: (SMD/THT)

Defined tracks:

Used tracks:

Defined vias:

Used vias:

Holes (excluding vias):

Oval holes:

Drill tools (including vias and computing adjusts and rounding):

Solder paste stats:

Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³ and 1.0 g/cm³ for the flux. This paste has an specific gravity of 4.15 g/cm³.

The stencil thickness is 0.12 mm.

Side Pads with paste Area [mm²] Paste [g]
Total 325 320.20 1.59

Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren’t computed.

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Credits

KiCad EDA

KiBot

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tracespace view - Online Gerber Viewer

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